Flip chip technology has been widely adopted in modern power light-emitting diode\n(LED) fabrications and its output efficiency is closely related to the submount material properties.\nHere, we present the electrical, optical and thermal properties of flip chip light-emitting diodes\nmounted on transparent sapphire and borosilicate glass which have shown a higher output luminous\nflux when compared to the traditional non-transparent mounted LEDs. Exhibiting both better\nthermal conductivity and good optical transparency, flip chip LEDs with a sapphire submount\nshowed superior performance when compared to the non-transparent silicon submount ones,\nand also showed better optical performance than the flip chip LEDs mounted on transparent\nbut poor-thermal-conducting glass substrates. The correspondent analysis was carried out\nusing ANSYS 14 to compare the experimental thermal imaging with the simulation results.\nTracePro software was also used to check the output luminous flux dependency on different LED\nmounting designs.
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